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1

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper)

Najm, Farid N., Sukharev, Valeriy

Year:

2019

Language:

english

File:

PDF, 42 KB

english, 2019

2

Stress assessment for device performance in three-dimensional IC: linked package-scale/die-scale/feature-scale simulation flow

Kteyan, Armen, Gevorgyan, Gevorg, Hovsepyan, Henrik, Choy, Jun-Ho, Sukharev, Valeriy

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2014

Language:

english

File:

PDF, 9.73 MB

english, 2014

3

Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation

Zschech, Ehrenfried, Ho, Paul S., Schmeisser, Dieter, Meyer, Moritz Andreas, Vairagar, Anand V., Schneider, Gerd, Hauschildt, Meike, Kraatz, Matthias, Sukharev, Valeriy

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 692 KB

english, 2009

4

Postvoiding Stress Evolution in Confined Metal Lines

Sukharev, Valeriy, Kteyan, Armen, Huang, Xin

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 1.35 MB

english, 2016

5

Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis

Sukharev, Valeriy

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2010

Language:

english

File:

PDF, 53 KB

english, 2010

6

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip Package Interaction

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Nakamoto, Mark, Zhao, Wei, Radojcic, Riko, Muehle, Uwe, Zschech, Ehrenfried

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.73 MB

english, 2017

7

Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

Sukharev, Valeriy

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.22 MB

english, 2014

8

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure

Sukharev, Valeriy, Zschech, Ehrenfried, Nix, William D.

Journal:

Journal of Applied Physics

Year:

2007

Language:

english

File:

PDF, 1.64 MB

english, 2007

9

Design-specific variation in pattern transfer by via/contact etch process: full-chip analysis

Sukharev, Valeriy

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2009

Language:

english

File:

PDF, 590 KB

english, 2009

10

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Physics-based simulation of EM and SM in TSV-based 3D IC structures

Kteyan, Armen, Sukharev, Valeriy, Zschech, Ehrenfried

Year:

2014

Language:

english

File:

PDF, 752 KB

english, 2014

11

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Multi-scale simulation flow and multi-scale materials characterization for stress management in 3D through-silicon-via integration technologies – Effect of stress on 3D IC interconnect reliability

Sukharev, Valeriy, Zschech, Ehrenfried

Year:

2014

Language:

english

File:

PDF, 2.11 MB

english, 2014

12

Multiscale Transient Thermal Analysis of Microelectronics

Barabadi, Banafsheh, Kumar, Satish, Sukharev, Valeriy, Joshi, Yogendra K.

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 1.60 MB

english, 2015

13

Electromigration assessment for power grid networks considering temperature and thermal stress effects

Huang, Xin, Sukharev, Valeriy, Choy, Jun-Ho, Chew, Marko, Kim, Taeyoung, Tan, Sheldon X.-D.

Journal:

Integration, the VLSI Journal

Year:

2016

Language:

english

File:

PDF, 8.35 MB

english, 2016

14

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Novel approaches to determine thermomechanical materials data in advanced interconnect stacks

Zschech, Ehrenfried, Gall, Martin, Clausner, Andre, Sander, Christoph, Sukharev, Valeriy

Year:

2016

Language:

english

File:

PDF, 397 KB

english, 2016

15

Analysis of the Effect of TSV-induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations

Kteyan, Armen, Muehle, Uwe, Gall, Martin, Sukharev, Valeriy, Radojcic, Riko, Zschech, Ehrenfried

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.31 MB

english, 2017

16

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Muehle, Uwe, Zschech, Ehrenfried, Radojcic, Riko

Year:

2016

Language:

english

File:

PDF, 3.36 MB

english, 2016

17

[IEEE 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Kamakura, Japan (2017.9.7-2017.9.9)] 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Finite-difference methodology for full-chip electromigration analysis applied to 3D IC test structure: Simulation vs. experiment

Choy, Jun-Ho, Sukharev, Valeriy, Chatterjee, Sandeep, Najm, Farid N., Kteyan, Armen, Moreau, Stephane

Year:

2017

Language:

english

File:

PDF, 520 KB

english, 2017

18

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems

Sukharev, Valeriy, Kteyan, Armen, Choy, Jun-Ho

Year:

2019

File:

PDF, 1.41 MB

2019

19

Photoassisted decomposition of salicylic acid on TiO2 and Pd/TiO2 films

Valeriy Sukharev, Aaron Wold, Yu-Ming Gao, Kirby Dwight

Journal:

Journal of Solid State Chemistry

Year:

1995

Language:

english

File:

PDF, 511 KB

english, 1995

20

Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance

Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner

Journal:

Journal of Electronic Testing

Year:

2012

Language:

english

File:

PDF, 514 KB

english, 2012

21

Concerning the role of oxygen in photocatalytic decomposition of salicylic acid in water

Valeriy Sukharev, Robert Kershaw

Journal:

Journal of Photochemistry and Photobiology A: Chemistry

Year:

1996

Language:

english

File:

PDF, 844 KB

english, 1996

22

Society Officers 1996–1997

Sukharev, Valeriy

Journal:

Academic Radiology

Year:

1997

Language:

english

File:

PDF, 36 KB

english, 1997

23

[ACM Press the The 51st Annual Design Automation Conference - San Francisco, CA, USA (2014.06.01-2014.06.05)] Proceedings of the The 51st Annual Design Automation Conference on Design Automation Conference - DAC '14 - Physics-based Electromigration Assessment for Power Grid Networks

Huang, Xin, Yu, Tan, Sukharev, Valeriy, Tan, Sheldon X.-D.

Year:

2014

Language:

english

File:

PDF, 524 KB

english, 2014

24

[IEEE 2009 10th International Symposium on Quality of Electronic Design (ISQED) - San Jose, CA, USA (2009.03.16-2009.03.18)] 2009 10th International Symposium on Quality of Electronic Design - Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation

Sukharev, Valeriy, Markosian, Ara, Kteyan, Armen, Manukyan, Levon, Khachatryan, Nikolay, Choy, Jun-Ho, Lazaryan, Hasmik, Hovsepyan, Henrik, Onoue, Seiji, Kikuchi, Takuo, Kamigaki, Tetsuya

Year:

2009

Language:

english

File:

PDF, 562 KB

english, 2009

25

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength

Sukharev, Valeriy, Zschech, Ehrenfried

Journal:

Journal of Applied Physics

Year:

2004

Language:

english

File:

PDF, 591 KB

english, 2004

26

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Electromigration analysis of full-chip integrated circuits with hydrostatic stress

Gibson, Patrick, Hogan, Matthew, Sukharev, Valeriy

Year:

2014

Language:

english

File:

PDF, 1.65 MB

english, 2014

27

Analytical modeling of silicon etch process in high density plasma

Abdollahi-Alibeik, Shahram, McVittie, James P., Saraswat, Krishna C., Sukharev, Valeriy, Schoenborn, Philippe

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1999

Language:

english

File:

PDF, 785 KB

english, 1999

28

Fluctuation Model of Chemical Mechanical Planarization

Sukharev, Valeriy

Journal:

Journal of The Electrochemical Society

Year:

2001

Language:

english

File:

PDF, 448 KB

english, 2001

29

[IEEE 2015 20th Asia and South Pacific Design Automation Conference (ASP-DAC) - Chiba, Japan (2015.1.19-2015.1.22)] The 20th Asia and South Pacific Design Automation Conference - New electromigration modeling and analysis considering time-varying temperature and current densities

Hai-Bao Chen,, Tan, Sheldon X.-D., Huang, Xin, Sukharev, Valeriy

Year:

2015

Language:

english

File:

PDF, 874 KB

english, 2015

30

[AIP Stress-induced Phenomena in Metallization - ()] AIP Conference Proceedings - Low-k Material Characterization with High Spatial Resolution: k Value and E Modulus

Zschech, Ehrenfried, Potapov, Pavel, Chumakov, Dmytro, Engelmann, Hans-Juergen, Geisler, Holm, Sukharev, Valeriy, Ogawa, Shinichi, Ho, Paul S., Zschech, Ehrenfried

Year:

2007

Language:

english

File:

PDF, 1.22 MB

english, 2007

31

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Preface: Stress-Induced Phenomena and Reliability in 3D Microelectronics

Ho, Paul S., Hu, Chao-Kun, Nakamoto, Mark, Ogawa, Shinichi, Smith, Larry, Sukharev, Valeriy, Zschech, Ehrenfried

Year:

2014

Language:

english

File:

PDF, 124 KB

english, 2014

32

[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization - Austin, Texas (USA) (14-16 June 2004)] AIP Conference Proceedings - Physically Based Simulation of Electromigration-Induced Degradation of Inlaid Copper Interconnects

Sukharev, Valeriy

Year:

2004

Language:

english

File:

PDF, 610 KB

english, 2004

33

[ACM Press the 52nd Annual Design Automation Conference - San Francisco, California (2015.06.07-2015.06.11)] Proceedings of the 52nd Annual Design Automation Conference on - DAC '15 - Interconnect reliability modeling and analysis for multi-branch interconnect trees

Chen, Hai-Bao, Tan, Sheldon X.-D., Sukharev, Valeriy, Huang, Xin, Kim, Taeyoung

Year:

2015

Language:

english

File:

PDF, 335 KB

english, 2015

34

[IEEE 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) - Rome, Italy (2015.7.22-2015.7.24)] 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) - Post placement leakage reduction with stress-enhanced filler cells

Choy, Jun-Ho, Sukharev, Valeriy, Kteyan, Armen, Hovsepyan, Henrik, Venkatraman, Ramnath, Castagnetti, Ruggero

Year:

2015

Language:

english

File:

PDF, 878 KB

english, 2015

35

[IEEE 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - San Jose, CA, USA (2014.11.2-2014.11.6)] 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - Lifetime optimization for real-time embedded systems considering electromigration effects

Kim, Taeyoung, Zheng, Bowen, Chen, Hai-Bao, Zhu, Qi, Sukharev, Valeriy, Tan, Sheldon X.-D.

Year:

2014

Language:

english

File:

PDF, 724 KB

english, 2014

36

Physics-based Electromigration Models and Full-chip Assessment for Power Grid Networks

Huang, Xin, Kteyan, Armen, Tan, Xiangdong, Sukharev, Valeriy

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2016

Language:

english

File:

PDF, 2.36 MB

english, 2016

37

Analytical Modeling and Characterization of Electromigration Effects for Multi-Branch Interconnect Trees

Chen, Hai-Bao, Tan, Sheldon, Huang, Xin, Kim, Taeyoung, Sukharev, Valeriy

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2016

Language:

english

File:

PDF, 1.88 MB

english, 2016

38

[IEEE 2015 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) - Istanbul, Turkey (2015.9.7-2015.9.9)] 2015 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) - Full-chip electromigration assessment: Effect of cross-layout temperature and thermal stress distributions

Huang, Xin, Sukharev, Valeriy, Jun-Ho Choy,, Chen, Haibao, Tlelo-Cuautle, Esteban, Tan, Sheldon X.-D.

Year:

2015

Language:

english

File:

PDF, 2.95 MB

english, 2015

39

[IEEE 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC) - Macao, Macao (2016.1.25-2016.1.28)] 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC) - Electromigration recovery modeling and analysis under time-dependent current and temperature stressing

Huang, Xin, Sukharev, Valeriy, Kim, Taeyoung, Chen, Haibao, Tan, Sheldon X.-D.

Year:

2016

Language:

english

File:

PDF, 299 KB

english, 2016

40

[IEEE 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - San Jose, CA, USA (2014.11.2-2014.11.6)] 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) - IR-drop based electromigration assessment: Parametric failure chip-scale analysis

Sukharev, Valeriy, Huang, Xin, Chen, Hai-Bao, Tan, Sheldon X.-D.

Year:

2014

Language:

english

File:

PDF, 2.88 MB

english, 2014

41

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy

Journal:

Zeitschrift für Metallkunde

Year:

2005

Language:

english

File:

PDF, 370 KB

english, 2005

42

[ACM Press the 47th Design Automation Conference - Anaheim, California (2010.06.13-2010.06.18)] Proceedings of the 47th Design Automation Conference on - DAC '10 - Closed-form modeling of layout-dependent mechanical stress

Joshi, Vivek, Sukharev, Valeriy, Torres, Andres, Agarwal, Kanak, Sylvester, Dennis, Blaauw, David

Year:

2010

Language:

english

File:

PDF, 247 KB

english, 2010

43

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 22 February 2009)] Design for Manufacturability through Design-Process Integration III - Design specific variation in pattern transfer by via/contact etch process: full-chip analysis

Sukharev, Valeriy, Singh, Vivek K., Rieger, Michael L., Markosian, Ara, Kteyan, Armen, Manukyan, Levon, Khachatryan, Nikolay, Choy, Jun-Ho, Lazaryan, Hasmik, Hovsepyan, Henrik, Onoue, Seiji, Kikuchi,

Year:

2009

Language:

english

File:

PDF, 392 KB

english, 2009

44

SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Microelectronic Device Technology III - Integrated simulation of the plasma-assisted gate oxide nitridation

Sukharev, Valeriy, Aronowitz, Sheldon, Zubkov, Vladimir, Puchner, Helmut, Haywood, John, Kimball, James P., Burnett, David, Tsuchiya, Toshiaki

Year:

1999

Language:

english

File:

PDF, 591 KB

english, 1999

45

Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing

Huang, Xin, Sukharev, Valeriy, Kim, Taeyoung, Tan, Sheldon X.-D.

Journal:

Integration, the VLSI Journal

Year:

2016

Language:

english

File:

PDF, 662 KB

english, 2016

46

[ACM Press the 53rd Annual Design Automation Conference - Austin, Texas (2016.06.05-2016.06.09)] Proceedings of the 53rd Annual Design Automation Conference on - DAC '16 - Physics-based full-chip TDDB assessment for BEOL interconnects

Huang, Xin, Sukharev, Valeriy, Qi, Zhongdong, Kim, Taeyoung, Tan, Sheldon X.-D.

Year:

2016

Language:

english

File:

PDF, 1.30 MB

english, 2016

47

[ACM Press the 35th International Conference - Austin, Texas (2016.11.07-2016.11.10)] Proceedings of the 35th International Conference on Computer-Aided Design - ICCAD '16 - Fast physics-based electromigration checking for on-die power grids

Chatterjee, Sandeep, Sukharev, Valeriy, Najm, Farid N.

Year:

2016

Language:

english

File:

PDF, 333 KB

english, 2016

48

AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - Multi-Scale Environment For Simulation And Materials Characterization In Stress Management For 3D IC TSV-Based Technologies—Effect Of Stress On The Device Characteristics

Sukharev, Valeriy, Zschech, Ehrenfried

Year:

2011

Language:

english

File:

PDF, 4.00 MB

english, 2011

49

Power Grid Electromigration Checking using Physics-Based Models

Chatterjee, Sandeep, Sukharev, Valeriy, Najm, Farid N.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2017

Language:

english

File:

PDF, 1.32 MB

english, 2017

50

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - 3D IC TSV-Based Technology: Stress Assessment For Chip Performance

Sukharev, Valeriy, Kteyan, Armen, Khachatryan, Nikolay, Hovsepyan, Henrik, Torres, Juan Andres, Choy, Jun-Ho, Markosian, Ara, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 4.17 MB

english, 2010

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